The tank and unloaders primary responsibilities are to melt the adhesive and pump it to the required location through heated hoses. The tanks and unloaders also serve as the temperature sensing and controlling center for the gluing system. Most included a microprocessor control that monitors the temperatures and regulates them accordingly.
Piston Pump: The piston pump is used primarily in packaging applications. The piston pump provides high adhesive output as well as high pressures which are ideal in applications where multiple beads and valves are activated at the same time. Piston pumps are required for applications firing bottom up or in horizontal fashion as their high pressure output gives the best possible instantaneous glue output.
Gear Pump: The gear pump is used primarily in applications involving high viscosity adhesives and/or where there is a requirement for very controlled and metered adhesive output. However, they can also be used in low volume packaging applications where small volumes of adhesive are required. Gear pumps deliver adhesive at a very constant and consistent pressure, controllable with a "pressure relief valve" located on the back of each gear pump unit. Gear pumps can also provide line speed tracking without the use of an EPC when they are equipped with a variable speed motor drive which can increase or decrease pressure depending on parent machine speed.
The Valco Melton (AFS) Auto Fill System is an economical addition to any hot melt system. The AFS is a self contained and controlled system that controls the level of hot melt adhesive in your melt tank without intervention from an line operator or maintenance staff.
All AFS systems operate on 110-120 VAC or 220-240VAC and can be tied into the existing power supply to the melt unit. A 3ft power cord is supplied with each AFS system.
The AFS system can accept adhesive chips up to 5/8” square. The system is not capable of feeding pillow form adhesive.
Included: The AFS features a venture vacuum that pulls the “chip” adhesive from an adhesive bin, through a feed tube and into the hot melt reservoir. Each AFS contains two key components.
The Lid Assembly features an all inclusive package that is designed for simple and easy installation onto any existing or new hot melt system. The Lid Assembly includes a small electrical enclosure that houses a level potentiometer, audible alarm beacon and on/off switch. The Lid Assembly also includes the inlet tube that inputs the adhesive into the reservoir while venting the vacuum air through an air filter.
The Feed Tube/Wand Assembly includes an aluminum wand that creates a vacuum which pulls the adhesive from up to 10 meters away. The wand includes a vibrator motor that keeps the adhesive chips loose and free to flow through the feed tube and into the adhesive reservoir. If more than 10 meters of tube is required there is a vacuum repeater that can be installed to increase the adhesive travel distance up to a maximum distance of 30 meters. This must be ordered separately and can be installed at the customer facility.
Optional: There is an optional Cool Bin adhesive receptacle that holds approximately 150lbs of chip adhesive. This bin is not part of the standard AFS system and must be ordered separately.
The Evolution C Series technology is the newest innovation for hot melt adhesive melters. The design is a culmination of features that were specifically crafted to meet the most current needs communicated by hot melt unit users worldwide. A new user-friendly control panel supports a quick and easy configuration to adapt to any work requirement. Valco Melton's new EC Series hot melt adhesive unit offers optimum reliability and total control of the unit's operation. Supported by the most current features and technology, the Valco Melton EC series unit easily takes recognition as the best in its class in performance.
The EC series tanks are comparable and compatible with the Nordson 2300 and 3000 series. All hoses, guns, pumps, filters are interchangeable. The EC series can be used in place of the Nordson Problue units.
EVA packaging adhesives and PSA pressure sensitive adhesives.
Temperature Control: The EC series uses a microprocessor temperature control that utilizes pulsating temperature regulation. This technology provides accurate and uniform heating of temperature zones to +-3° through the RTD located in each electrical component.
Programmable Settings: The microprocessor control on the EC series units has the ability to receive customer input as well as provide output signals such as system ready and pump ready. These can be used to provide glue system ready and alarm/fault indication.
7 Day Clock: The EC series has a built in programmable clock that automatically controls the on/off and setback options for up to 3 shifts per day, 7 days per week. This allows the customer to control the glue system per their production requirements.
Visual Fault Display: If a fault occurs with the melt tank or any peripheral component a “RED” led will light on the control screen alerting the operator of a fault.
Temperature Setback: The EC series has the ability to program temperature setback times as well as “one-touch” temperature setback. This gives the customer to ability to configure a lower temperature for the glue system while the system is not in use which keeps the adhesive fresh and reduces the possibility of char forming inside the glue system due to long periods of stagnation and high temperature.